TFT-LCD & Flexible OLED Laser Equipment
Engineered for TFT-LCD and Flexible OLED display manufacturing, CKD provides advanced laser defect repair and laser lift-off equipment, covering applications such as TFT-LCD dot/line defect repair and Flexible OLED Laser Lift-Off (LLO).
From R&D sampling and pilot production to full-scale mass production, we deliver tailored laser equipment and solutions to meet diverse display panel processing needs.
Why Display Panel Repair Requires Lasers
In display panel manufacturing, laser repair is essential for boosting yield rates and controlling production costs:
Save Costs: Reclaims defective panels, preventing costly scrap and boosting yield.
Micron Precision: Ultra-fine laser beam targets microscopic shorts, bright spots, and dust with surgical accuracy.
Zero Damage: Non-contact processing with minimal heat leaves surrounding pixels completely unharmed.
Line-Speed Fast: Takes milliseconds per repair, perfectly matching high-speed automated production.
Bottom Line: Turns factory scrap into sellable yield in milliseconds.
TFT-LCD Laser Defect Repair
At CKD, we provide high-precision laser equipment for display panel processing, helping customers boost yield rates and lower costs through stable, reliable processes.
Delivers high-precision localized micro-processing for micron-level spot defects on TFT-LCD panels, including bright spots, short circuits, and foreign particles.
Key Features: Equipped with a high-magnification vision alignment system with dynamic, micron-level control over laser spot shape and size based on defect geometry.
Technical Advantages: Delivers precisely controlled energy with a minimal Heat-Affected Zone (HAZ), eliminating defects while leaving adjacent pixels and circuits undamaged.
Suitable For: TFT-LCD line spot defect repair | High-PPI panel micro-repair
Enables fast, targeted laser cutting and repair for continuous line defects occurring in TFT-LCD production, such as signal line shorts and bright lines.
Key Features: Supports real-time tracking for complex or irregular paths, featuring fast-galvo scanning to keep pace with high-speed production line rhythms.
Technical Advantages: Cuts target lines with extreme precision without damaging the underlying glass substrate or encapsulation layer, significantly reducing Tact Time per line.
Suitable For: Medium to large TFT-LCD panel lines | Automated in-line defect reduction
Designed for the critical LLO process in flexible OLED manufacturing, utilizing laser energy to induce photothermal decomposition of the Polyimide (PI) sacrifice layer, realizing damage-free separation of the flexible display from the glass carrier.
Key Features: Uses a high-uniformity beam homogenization optical system to guarantee consistent energy output across large processing areas.
Technical Advantages: Non-contact photolytic lift-off with zero mechanical stress or pulling, preventing panel bending, layer delamination, or thermal distortion for consistent output quality.
Suitable For: Flexible OLED production lines | Substrate lift-off for foldable displays & wearable electronics