Laser Cleaning & Adhesive Removal Machines
视频介绍
CKD Laser Cleaning & Adhesive Removal Machine Capabilities
Utilizing high-precision laser cold ablation to replace traditional wet chemical methods, ensuring zero substrate damage and seamless SECS/GEM smart factory integration.
- Mold Connection Deflashing
- Wafer & Substrate Cleaning
- UV Tape & Adhesive Residue Removal
- Leadframe Selective Ablation
- Non-Contact Cold Processing
- R&D & Prototyping
- Low-Volume Production
- Mid-Volume Production
- Mass Production
- 24/7 Full Automation
- Epoxy Resin
- UV Tapes & Adhesives
- Temporary Bonding Adhesives
- Flash & Thermoplastic Resin
- Silicon Wafers & Leadframes
- Micron-level Selective Ablation
- Minimal Thermal Effect Zone (HAZ)
- Sub-micron Depth Control
- Zero Substrate Damage
- 4" / 6" / 8" / 12" Wafer & Custom Substrates
- AOI Vision Alignment System
- Robotic Arm Auto Loading / Unloading
- SECS/GEM Protocol Integration
Laser Cleaning System Selection & Customization
Offering standard Dual-Head, Quad-Head, and Rotary architectures. Have unique part geometries, custom trays, or line integration requirements? We deliver 100% custom-engineered solutions.
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CKD激光除胶机针对半导体&微电子行业
我们熟知除胶传统除胶方式，会产生什么问题，我们生产我们的激光除胶机，但是对于半导体&微电子标准一直是非常严格，CKD作为多年的激光机器的制造者，在XX年进军半导体行业，深入研究，加大投入来弄个我们的激光系统， 所以生产出非常好的机器，完美解决了XX问题
Semiconductor
- Semiconductor components
- Semiconductor packaging
- Wafer-related components
- Semiconductor equipment parts
Microelectronics
- Electronic components
- Precision electronic parts
- Ceramic/electronic substrates
- PCB-related precision components
Advantages of Laser Adhesive Removal Machines in Manufacturing
与传工艺相比，激光切割易脆玻璃，它解决了传统上的XXXX 问题CKD replace traditional wet chemical solvents and mechanical scraping with non-contact laser ablation, maximizing packaging yield while lowering operational costs.
Boost Chip Yield
Non-contact processing eliminates mechanical stress and micro-cracks on delicate wafers and chips, minimizing defect rates.
Increase Throughput
Dual, quad, and rotary setups deliver dynamic multi-beam processing, significantly shortening takt time and boosting UPH.
Ensure Consistency
Digital beam control eliminates human error, ensuring repeatable cleaning quality and high CPK stability across batches.
Cut Consumable Costs
Eliminates toxic solvents, specialized wipes, and hazardous waste disposal fees, reducing overall long-term OPEX by 40%+.
Reduce Rework
Ablates adhesive layers in a single dry pass without chemical residue, eliminating cross-contamination and costly rework.
Upgrade Automation
Integrates seamlessly with AOI vision, robotic handling, and SECS/GEM protocols for Class 100/1000 cleanroom automation.
Which Laser Adhesive Removal System Fits Your Line?
Select the ideal laser architecture based on your throughput goals, component geometry, and automation requirements.
3种机器的除胶效率，尺寸，切割复杂效果，分别适合的场景
| Model | Dual-Head Laser System | Quad-Head Laser System | Rotary Laser System |
| Pros | Dual-Head Parallel / High ROI Balances dual-station flexibility and doubles processing throughput | 4-Head Array / Max UPH Minimizes takt time for ultra-high throughput; lowest per-unit cost | Multi-Axis Rotary / 360° Clean Uniform, 360° coverage for cylindrical and non-planar parts |
| Limitations | Lower throughput ceiling compared to quad-head in mass lines | Higher initial CAPEX; requires upstream automated line synergy | Cycle time limited by rotation speed; restricted to specific geometries |
| Target Workpieces | Die attach deflashing, lead frames, wafer & substrate residues | High-capacity OSAT facilities, large-format trays, multi-strip panels | Optical lens mounts, cylindrical sensors, micro-bearings, 3D parts |
| Operational Lifespan | Laser source hrs; 24/7 heavy-duty design (8–10 yrs) | Laser source hrs; continuous inline standard (8–10 yrs) | Laser source hrs; rotary stage maintenance required (7–10 yrs) |
| Cost & Price Range | Moderate (Best ROI) Ideal for medium batches, dual-station setups, & R&D labs | Higher (High CAPEX / Low OPEX) Higher initial cost, but lowest long-term cost per unit in mass processing | Moderate-to-High Varies based on rotary stage precision and multi-axis motion controls |
